FAaST PDM
The Plasma Damage Monitor (PDM) provides a non-contact, real-time technique for monitoring of plasma charging, without the need to build costly and time consuming test structures. Correlation to traditional techniques has been established in numerous tests / locations for charging damage due to antenna effect. Additionally, secondary damage such as UV radiation damage may also be assessed by measuring additional parameters - such as Dit and dielectric leakage.
The FAaST series of PDM tools provide:
- FastMaps of plasma charging – Residual charge left on the surface of a dielectric after plasma processing can be imaged, with >6000 points measured in ~3 minutes.
- Trapped and interface charges induced by plasma processing, using COCOS measurement technology.
- Dielectric film quality and radiation induced damage is measured using SASS I-V, SILC, and Soft Breakdown Field.
- Fully automated operation, with multiple security levels designed for the manufacturing environment.
- Options such as SMIF / FOUP loadports, automatic lot ID, wafer OCR, and fully SEMI compliant automation for data upload and remote system control.
- Automatic internal calibration.
The FAaST 200 series can be configured for multiple wafer sizes from 100mm to 200mm, and FAaST 300 series for 200mm-300mm wafers. Stand alone PDM systems are available for routine monitoring of residual plasma charge, or PDM tools can be combined with SDI’s other technologies, such COCOS / CV / or SL, to minimize footprint, and provide complimentary measurements for more complete plasma tool characterization.