BX- 30
Based on significant improvements to the the original Boxer-Cross technology the Semilab BX-30 enables in-line monitoring of implant/anneal processes on product wafers for immediate, accurate, and low-cost production control of implant and RTP systems and in-line monitoring for pre and post anneal implant.
Value Proposition
- Non-contact optical method measures directly on product wafers à low cost, lower cycle time, represents true product results
- Quickly locates source of implant/anneal module problems by providing both implant dose and RTP control measurements
- Highest throughput in market for production monitoring applications
- New advanced optics designed for high stability, MTBF and MTTR
Application Capability
- Implant dose concentration
- dose range 1x1010 cm-2 to 1x1016 cm-2;
- energy range 100 eV to 3 MeV
- species As, B, P, BF2, In, Sb (other species under development)
- Process requirements- Unannealed implanted layers, Surface oxide < 20 nm (200 Å)
- Repeatability- 1 σ < 0.5% for critical dose ranges
- PAI depth – depth range10 nm to 100 nm
- Junction depth measurement- depth range10 to 70 nm
- Measurement on SOI substrates (under development)
- Lateral diffusion measurement (under development)
- Metal structures measurement (v.d)
Hardware Technology:
- High-reliability, solid state pump and probe lasers (830 nm red pump- 980 nm IR probe)
- 2-3um diameter measurement spot
- Cognex pattern recognition system
- Dual foup 200 and 300 mm bridge platform