SSM 5130 & 530 Systems
The SSM 5130 fully automatic mapping system provides a variety of electrical characterization measurements for non-patterned wafers used in epitaxial silicon production and front-end semiconductor processing. Wafers are robotically loaded onto the mapping stage from a cassette or opened FOUP. The test wafer moves to each site specified in a pre-programmed map as electrical characterization tests are made. The system stores test data and reports it in a variety of formats. The SSM 530 system has the same abilities, however it does not have a robot.
The SSM 5130 and 530 eliminate the need for costly metal and poly deposition processes by using a pneumatically controlled, non-damaging probe design and a top-side mercury contact. With separate probe and chuck vacuum lines, the system features an extremely stable contact area and uses only a small quantity of mercury to make highly repeatable measurements for process development and process monitoring applications.
Typical SSM 5130 and 530 applications
- EPI resistivity
- Low-k dielectric constant
- Oxide integrity
SSM 5130 and 530 features
- Wafer diameter from 200 mm to 300 mm
- Single-site and multiple-site maps
- Automatic face-up loading prevents wafer damage
- Precision pressure regulators for Hg contact
- PROCAP software provides a full suite of measurements
Applications:
- Dielectric Characterization
- Epi Layer Monitoring
Technologies:
- Epi Layer Resistivity